Semiconductor devices. Micro-electromechanical devices - Bend testing methods of thin film materials Ingestion-build-61878

Semiconductor devices. Micro-electromechanical devices - Bend testing methods of thin film materials Ingestion-build-618781 Scope This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 m and 10 m. Thin films are used as main structural materials for Micro electromechanical Systems (abbreviated as MEMS in this document) and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as a few micron meter size, material

with the requirements of various protection objectives

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The dimensions of the outer package and the number of immediate packages

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Those with responsibility for town centre management

It also specifies methods to calculate:

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1   This standard applies for

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